Data sheet

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µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000

D
D
D
D
D
D
D

Short-Circuit Protection
Offset-Voltage Null Capability
Large Common-Mode and Differential
Voltage Ranges
No Frequency Compensation Required
Low Power Consumption
No Latch-Up
Designed to Be Interchangeable With
Fairchild µA741

description
The µA741 is ageneral-purpose operational
amplifier featuring offset-voltage null capability.

µA741M . . . J PACKAGE
(TOP VIEW)

NC
NC
OFFSET N1
IN –
IN +
VCC –
NC

OFFSET N1
IN –
IN +
VCC –

The µA741C is characterized for operation from
0°C to 70°C. The µA741I is characterized for
operation from – 40°C to 85°C.The µA741M is
characterized for operation over the full military
temperaturerange of – 55°C to 125°C.

NC
OFFSET N1
IN –
IN +
VCC –

12

4

11

5

10

6

9

7

8

1

7

3

6

4

NC
VCC+
OUT
OFFSET N2

8

2

5

µA741M . . . U PACKAGE
(TOP VIEW)

symbol

1

9

3

8

4

7

5

NC
NC
VCC +
OUT
OFFSET N2

10

2

6

µA741M . . . FK PACKAGE
(TOP VIEW)

NC
OFFSET N1
NC
NC
NC

OFFSET N1
+
OUTIN –

13

3

NC
NC
NC
VCC +
OUT
OFFSET N2
NC

14

2

µA741M . . . JG PACKAGE
µA741C, µA741I . . . D, P, OR PW PACKAGE
(TOP VIEW)

The high common-mode input voltage range and
the absence of latch-up make the amplifier ideal
for voltage-follower applications. The device is
short-circuit protected and the internal frequency
compensation ensures stability without externalcomponents. A low value potentiometer may be
connected between the offset null inputs to null
out the offset voltage as shown in Figure 2.

IN +

1



OFFSET N2
4

3 2 1 20 19
18

5

17

6

16

7

15

8

14
9 10 11 12 13

NC
VCC +
NC
OUT
NC

NC
VCC–
NC
OFFSET N2
NC

NC
IN –
NC
IN +
NC

NC – No internal connection

Copyright © 2000, TexasInstruments Incorporated

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

1

µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 –REVISED SEPTEMBER 2000

AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL
OUTLINE
(D)

TA

CHIP
CARRIER
(FK)

CERAMIC
DIP
(J)

CERAMIC
DIP
(JG)

PLASTIC
DIP
(P)

TSSOP
(PW)
µA741CPW

0°C to 70°C

µA741CD

µA741CP

– 40°C to 85°C

µA741ID

FLAT
PACK
(U)

CHIP
FORM
(Y)

µA741IP

– 55°C to 125°C

µA741MFK

µA741MJ

µA741MJG

µA741Y
µA741MU

The D packageis available taped and reeled. Add the suffix R (e.g., µA741CDR).

schematic
VCC+

IN –

OUT
IN+

OFFSET N1
OFFSET N2

VCC –

Component Count
Transistors
Resistors
Diode
Capacitor

2

POST OFFICE BOX 655303

22
11
1
1

• DALLAS, TEXAS 75265

µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000

µA741Y chipinformation
This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS

(7)

(6)

IN +

(3)
(2)

IN –
OFFSET N1

(1)

OFFSET N2

(8)

(5)

VCC+
(7)
+

(6)
OUT

–(4)
VCC –

45

(5)

(1)

(4)

CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C.

(2)

(3)

TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.

36

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

3

µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000

absolute maximum ratings over operating...
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