Data sheet led

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KADS-8072QR4A35Z4S

PRELIMINARY SPEC

SERIES

ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES

yal
in

數位簽署者:yalin
DN:cn=yalin, o, ou=SPEC
專用, email=yalin@yalin.
com, c=
日期︰2011.11.26 09:27:31
+08'00'

Applications
Substitution of micro incandescent lamps.

Features

Portable light source.

●High efficient lightsource.

Signaland symbol luminaire for orientation.

●Designed for high current operation.

Marker lights (e.g. steps, exit ways, etc).

●Low thermal resistance.

Decorative and entertainment lighting.

●Encapsulation : Silicone resin.

Commercial and residential lighting.

●Compatible with IR-reflow processes.

Emergency-vehicle lighting.

Moisture sensitivity level : level 4.
●ESDprotection .

Application Note
Static electricity and surge damage the LEDS.

●RoHS compliant.

It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.

Package Dimensions

Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Thespecifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.

SPEC NO: DSAM0284

REV NO: V.4B

DATE: NOV/26/2011

APPROVED: WYNEC

CHECKED: Allen Liu

DRAWN: J.Yu

PAGE: 1 OF 9

Handling Precautions
Compare to epoxyencapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1.Handle the component along the side surfaces by using forceps or appropriate tools.

2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.

4.1.There should be enough space inside the nozzle to avoid contact withthe dome lens during pick up.
4.2. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.3. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.4. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoiddamage during production.

5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
Leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAM0284

REV NO: V.4B

DATE: NOV/26/2011

APPROVED: WYNEC

CHECKED: Allen Liu

DRAWN: J.Yu

PAGE: 2 OF 9

FluxCharacteristics at 350mA Ambient Temperature, Ta = 25°C
Color

Luminous Flux (lm)
@ 350mA [1]

Part No.

Typical Luminous
Flux (lm) [1]

Code.

100

100

120

B13

80

90

B14

90

100

C1

100

120

B13
Neutral White (InGaN)

90

C1

Neutral White (InGaN)

Max.

B14
Cool White (InGaN)

Min.

80

90

B14

90

100

KADS-8072QR4A35Z4S-C1KADS-8072QR4A35Z4S-N2

KADS-8072QR4A35Z4S-N1

105

C1

100

120

70

80

B13

80

90

B14

90

100

C1

100

120

B12

70

80

B13

80

90

B14

90

100

C1

Warm White (InGaN)

100

B12
Warm White (InGaN)

90

100

97

90

B14

105

120

80

C1

KADS-8072QR4A35Z4S-W3

100

B13
Warm White (InGaN)

Typ.

120...
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